Preliminary Study on Electrodeposition of Copper Platings and Codeposition of Carbon Nanotubes from Organic Solvent

Metal/carbon composite plating is an effective strategy for improving and adding properties to metal by incorporating carbon materials into the matrices. Copper (Cu) widely applied, particularly in areas of heat management electronic packaging owing its high thermal electrical conductivities, which can be further improved together with improvements mechanical compositing it nanotubes (CNTs). However, because hydrophobic CNTs are hardly dispersible aqueous solutions, additional intense acid treatment or addition dispersants required their dispersion. Moreover, previous studies have reported that these methods suffer from deterioration material performance through destruction CNT surface inclusion plating. Therefore, this study, electrodeposition a Cu/CNT non-aqueous solvent disperse without any investigated. The experimental results show possible deposit Cu N-methyl-2-pyrrolidone containing copper iodide potassium iodide. Furthermore, platings up 0.12 mass% were prepared constant current electrolysis, applying pulse electrolysis increase content 0.22 mass%.